Equipment Analytical instruments Electronics fabrication Fieldwork General Laboratory Equipment Imaging Mechanical fabrication (-) Nanofabrication Scientific computing Sequencing Vivarium Facet Equipment Category Group 3D printing (-) Backend equipment Characterization Deposition Etching Lithography Nanofab sample preparation Ovens and Furnaces Sample preparation Facet Equipment Category External Use?YesConsultationNo - Any -Animal ResourcesBasic Lab SupportEngineeringEnvironmental Science and InformaticsInstrumental AnalysisMarine ScienceScientific Computing and Data AnalysisScientific ImagingSequencing Clear filters Ball /Wedge Wire Bonder Maker: TPT Model: HB16 The TPT HB16 model is a Ball/wedge wire bonder that enables electrical interconnection between a device chip and package using a gold wire. External Use: Yes | User/Staff Operated Wedge Wire Bonder Maker: Kulicke and Soffa Ltd. Model: 4523AD The Kulicke and Soffa Model 4523 wedge wire bonder provides electrical interconnects between a device chip and package using aluminum or gold wires. External Use: Yes | User/Staff Operated
Ball /Wedge Wire Bonder Maker: TPT Model: HB16 The TPT HB16 model is a Ball/wedge wire bonder that enables electrical interconnection between a device chip and package using a gold wire. External Use: Yes | User/Staff Operated
Wedge Wire Bonder Maker: Kulicke and Soffa Ltd. Model: 4523AD The Kulicke and Soffa Model 4523 wedge wire bonder provides electrical interconnects between a device chip and package using aluminum or gold wires. External Use: Yes | User/Staff Operated
