Ball /Wedge Wire Bonder

The TPT HB16 model is a Ball/wedge wire bonder that enables electrical interconnection between a device chip and package using a gold wire.

Ball/wedge wire bonding is a semiconductor packaging technique used to connect integrated circuits to a support. The system utilizes a small ball of gold formed at the end of the bond wire, which is pressed onto the bonding pad, then the system applies mechanical pressure combined with ultrasonic power to create a strong connection. The bond wire is made of gold.

Reservations & Training

Inventory ID:

ENG-E3

Manufacturer:

TPT

Model:

HB16

Year Installed:

2023