Wedge Wire Bonder

The Kulicke and Soffa Model 4523 wedge wire bonder provides electrical interconnects between a device chip and package using aluminum or gold wires.

Wedge/wedge wire bonding is a semiconductor packaging technique used to connect integrated circuits to a support. The system applies mechanical pressure combined with ultrasonic power to melt and create a strong connection. The bond wire is typically made of gold or aluminum.

Reservations & Training

Inventory ID:

ENG-E3

Manufacturer:

Kulicke and Soffa Ltd.

Model:

4523AD

Year Installed:

2012